Chip Quik SMD291SNL250T5 Solder Paste in jar 250g (T5) SAC305 no clean
Product details
| Management number | 221722490 | Release Date | 2026/05/03 | List Price | US$67.52 | Model Number | 221722490 | ||
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| Category | |||||||||
Description Solder Paste in jar 250g (T5) SAC305 no clean 88% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
- Lead-Free / RoHS Compliant
| Color | Multicolor |
|---|---|
| Material | Metal |
| Item Weight | 8.8 ounces |
| Part Number | SMD291SNL250T5 |
| Manufacturer | Chip Quik® |
| Batteries Included | No |
| Batteries Required | No |
| Product Dimensions | 2.17 x 2.17 x 2.17 inches |
| Item Package Quantity | 1 |
| Is Discontinued By Manufacturer | No |
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